Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA

Customization: Available
Metal Coating: Tin
Mode of Production: SMT

Products Details

Basic Info.

Model NO.
YCTBJ-254
Condition
New
Transport Package
Bubble Anti-Static Bag
Specification
Custom
Trademark
YCT
Origin
China
HS Code
8534009000
Production Capacity
100000piece/Year

Product Description


We provide the PCBA/ PCB one-stop custom services/ PCBA Custom service.
Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA

Custom Production Capacity

PCB custom capacity

Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L-18L, HDI 20-28 , HDI
Material CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina)
PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm           PTH:±0.076MM     NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

PCBA custom Capacity

 

    Stencil Size

   736x736mm
   Minimum IC Pitch    0.2mm
   Maximum PCB size    510X460mm
   Minimum PCB thickness    0.5mm
   Minimum chip size:    0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
   Maximum BGA size:    74x74mm
   BGA ball pitch:    1.00mm (minimum), 3.00mm (maximum)
   BGA ball diameter:    0.40mm (minimum), 1.00mm (maximum)
   QFP lead pitch:    0.38mm (minimum), 2.54mm (maximum)
   Machine Type    Panasnic CM 402
   Panasnic DT301
    Panasnic CM 402    patch speed:0.06sec/ chip (up to 60,000cph)
   Patch precision:±0.03~±0.005mm
   PCB size:max:510X460mm,min:50X50mm
   element size: 0603mm-50X50mm
   Panasnic DT301     patch speed:0.7sec/ chip
    Patch precision:±0.03~±0.005mm
    PCB size:max:510X460mm,min:50X50mm
    element size: 1005mm-100X90mmX25mm  high speed multifunctional mounter
   Volume:    One piece to low volume production quantities
   Low cost first prototype Fab
Fast deliveries
   Assembly type:    SMT assembly
   DIP assembly
   Mixed(surface mount and through hole) technology
   Cable assembly
   Components type:    Passive components
   As small as 0402 package
   As small as 0201 with design review
   Ball Grid Arrays(BGA):
   As small as .5mm pitch
     Component source    Shar,poshiba, ST, 
   Samsng, Infineon, Ti,
   ON,Microchip etc.
   Parts procurements:    provide one-stop services
   Only Assembly service (you supply the parts)
   You supply some parts(expensive/important components), we do the rest
   Solder type:    Leaded
   Lead-free/ROHS compliant
   Other capabilities:    Repair/rework services
   Mechanical assembly
   Box build
   Mold and plastic injection.
    Testing Type      First prototype test before mass quantity production
     AOI 
     BGA X-ray
     PCB E-test
Lead time   According Digikey components delivery time


Besides, we also offer the customization of all kinds of wiring harness.
• We offer the production and assembling of various electronic cables and communication cables.
• In the aspects of opening, crimping, pre- assembly, and final assembly, we would use verified materials and professional automation equipment.
• To realize the whole process control of quality, we would use the wiring harness detector to test the first piece.


Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA

Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBAShenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA

Packaging
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.
Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA

Shenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBAShenzhenpcba Manufacturers 15 Years Printed Circuit Board Assembly Custom Wholesale Production of Double Multilayer 4 6 8 10 12 Layer SMT PCB PCBA
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